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Solder balls are used for semiconductor packaging techniques such as BGA (Ball Grid Array) and CSP (Chip Sized Package), which electrically and mechanically connect the silicon die with substrate or PCB. Duksan Hi-Metal manufactures high-quality solder balls featuring a smoother surface, higher spherical form and tighter size-tolerance, based on the innovative production system.
Lead-free solder generally means solder that contains Pb under 0.1wt%. Most conventional lead-free solder for reflow application uses SnAgCu alloy. Duksan adds some special metals to SnAgCu alloy for its GR series solder ball, improving the problems such as oxidation, wettability, heat resistance and strength, which are frequently founded at conventional SnAgCu alloy. Most of the conventional lead-free solder balls have rougher surfaces than non lead-free solder balls, because of dendrite formation on the surface. However, Duksan significantly solves the problem using a specially developed flux system. Satisfying requirements regarding Drop/Bending/Twist & Thermal cycle test, GR series solder ball from Duksan Hi-Metal is now supplied to Samsung Electronics, Hynix Semiconductors, StatsChip Pack Korea, Signetics Korea, etc, thus saving the customer time and costs.
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