Duksan Hi-Metal Co., Ltd.

INTRODUCTION

PRODUCT LIST

Solder Balls
Solder balls are used for semiconductor packaging techniques such as BGA (Ball Grid Array) and CSP (Chip Sized Package), which electrically and mechanically connect the silicon die with substrate or PCB. Duksan Hi-Metal manufactures high-quality solder balls featuring a smoother surface, higher spherical form and tighter size-tolerance, based on the innovative production system.

GR series Solder Ball for Semiconductor Packaging
Solder balls are used for semiconductor packaging techniques such as BGA (Ball Grid Array) and CSP (Chip Sized Package), which electrically and mechanically connect the silicon die with substrate or PCB. Dukcsan Hi-Metal manufactures high-quality solder balls featuring a smoother surface, higher spherical form and tighter size-tolerance, based on the innovative production system, Lead-free solder generally means solder that contains pb under 0.1wt%