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Iljin Copper Foil Co., Ltd. developed electrodeposited copper foil for PCB for the first time in Korea in 1988. It thus provided an essential base material for the electronics industry, which had until then been supplied through imports.
Operating the largest single factory in the world for electrodeposited copper foil for PCB, and based on its more than 20 years of experience and technology, the company’s copper foil is recognized as one of the bestquality products at home and abroad. In addition to 8 um copper foil that is currently produced, the company is developing new products such as ultra-thin (1-5 um) copper foil, Very Low Profile copper foil for fine-patterns, and embedded copper foil (IEP).
Founded in 1987, Iljin has for more than 20 years produced various copper foil products for lithium ion batteries, EMI shielding film for Plasma Display Panel, Flexible PCB and fine pattern multilayer PCB.
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