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JUSUNG has unique technology for dealing with film deposition equipment for semiconductor elements, including selective semi-spherical silicon deposition and atomic layer deposition, and the company was recognized as the No.1 in global market share by an independent international research organization.
With the high concentration and micronization of semiconductor devices, demand for JUSUNG’s SDCVD (ALD) will be expected to be increased. HDPCVD and Poly Etcher, proven to be effective for mass production by its clients, are universal equipments for use in not only DRAMs but also in the non-memory NAND flash and logic fields, playing an important part in its efforts to diversify its product lines.
SDCVD (Space divided CVD-ALD) is one of the most advanced and promising thin film technologies. Thanks to its superior film qualities including impurity-free film, excellent step coverage, good uniformity and lower process temperature, SDCVD is expected to soon replace conventional thin film technologies such as CVD and PVD.
JUSUNG’s development strategy is to advance hardware concepts to meet the requirements of micro device makers. One of the unique hardware concepts is the single-wafer type, which is suitable for very thin film deposition and integration with other thin film processes. Another new concept is the semi-batch type, which is appropriate for thick film deposition and stand-alone processes. JUSUNG’s system guarantees the highest throughput with excellent film quality.
(1)CYCLONE PLUSTM System
The most significant disadvantage of Atomic Layer Deposition (ALD) is low throughput. To maximize the throughput of ALD, JUSUNG has developed an innovative semi-batch type system with a five-wafer batch size. In addition, a rotating injector has been developed to cover a larger deposition area. The technical advantages of rotating injectors are good uniformity of gas distribution, higher deposition rate, and minimization of valve control. JUSUNG's CYCLONE PLUSTM system guarantees to deliver the world’s highest throughput.
(2)EUREKATM System
JUSUNG has developed EUREKATM, a single wafer system with a unique injector and reactor. The injector is located in the center of the top lid (the “top injector”), and its structure is very simple compared to the shower head type. Due to the injector’s small volume, it takes a relatively short time to purge the source and reactant. The reactor structure is also much simpler than that of the laminar flow type ALD system. Therefore, this single wafer system guarantees easy maintenance, high reliability and repeatability. Another important advantage of this system is that it performs both pure and pseudo ALD processes, while the shower head and laminar flow types can only perform either the pseudo or pure process.
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