EF Engineering has ever since in 1996 been manufacturing precision parts of FPD, semiconductor equipment and automation facilities, contributing to the development of the nation¡¯s parts industry.
By applying standard parts to the manufacturing of FPD, semiconductor, PCB devices and automation facilities, the company has improved efficiency in terms of time and cost.
EF Engineering¡¯s flagship product FPCB automation equipment is used to make coverlay shape before coverlay bonding. This automation equipment punches 1 row only in Y direction step by step and then it feeds coverlay and then punches next row and then feeds coverlay again. It repeats punching in this way.
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