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Since its establishment in 1980, HANMI Semiconductor Inc. has been
engaged in the production of semiconductor equipment. The company has
grown steadily into a world-class manufacturer whose products are exported
to more than 180 foreign customers all over the world.
The firm’s mainstream items include sawing & placement system, cam
press, auto molding system, laser cutting equipment, laser marker and 3D
vision inspection equipment.
Notably, for the past several years, the maker’s sawing & placement
system has maintained world’s top position in terms of global market share. Employing tapeless sawing method,
it guarantees high productivity (UPH 20,000). Using diamond coated sawing blade, it cuts CSP (Chip Sclae
Package) semiconductors such as OFN, BGA, BOC, flip-chip and memory card packages, into individualized
packages. Then, it automatically dries, inspects, sorts and loads them.
The manufacturer has made intensive investment in research and development. As a result, it was selected as
an ‘Advanced Technology Center’ by the government in 2008.
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