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Over the past two decades, EO Technics has specialized in the field of
laser technology and applications. The company supplies a broad spectrum
of equipment for laster marking, drilling, trimming and cutting. Today, it is
one of the leading domestic suppliers of laser-based devices for use in the
fields of semiconductors, PCBs, FPDs (Flat Panel Displays) and
telecommunications.
Among the maker’s mainstream items are laser markers for wafers (CSM
Series). They can mark 100% at wafer-level and backside of the wafer
without damaging the dies. Chip miniaturization marking is possible with
accuracy at 50um. With auto wafer mapping capability, marking on only
identified good die is achievable. Also, it is operating in the Windows NT format and is user-friendly. CSM series
can handle 100~200mm wafers and 300mm wafers. They guarantee excellent quality and very high accuracy and
yield.
With ISO 14001 and ISO 9001 international certifications, the manufacturer exports mainly to China, Taiwan,
Singapore, Japan and the U.S. Efforts are being made to further explore European market.
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