Jusung Engineering Co., Ltd.
JUSUNG Engineering is making active advances based on its stable performance in the existing business areas as it entered the solar cell and LED equipment market that is drawing attention as a next generation leader of the global equipment market.
It has been recognized for its world-class competitiveness in the field of “deposition.” This technology refers to a series of processes to deposit an electrical thin film in molecular or atomic units to semiconductor wafers and LCD glass substrate as well as to solar cell, LED and OLED. It is known to be a core equipment technology that affects quality of the final products.
SD CVD (ALD), semiconductor manufacturing equipment, was selected by an overseas market survey organization as a deposition equipment of the highest global market share in relation to specific processes, such as selective semi-spherical silicon and atomic layer deposition.
As such, it has secured independent technological power. Its strategy for the atomic layer deposition technology (SD CVD (space divided CVD)) development is to manufacture state-of-the-art semiconductor elements with competitive technology and to develop new equipment and process technologies to satisfy diverse needs.
It is witnessing positive responses in the market by developing SD CVD (ALD) as a device that is capable of processing five wafers at a time, suitable for integration with other thin film deposition technologies, suitable for a process that requires a relatively larger thickness and capable of providing the highest productivity.
Its MO CVD equipment provides excellent constitution, large-area film uniformity, high deposition rate and uniform deposition due to the chamber structure and the LCD that was developed with its patented technology.
The equipment is widely used in semiconductor process lines for diverse applications such as high dielectric films and metal films. Due to its unique technical power, JUSUNG offered the highest-class integration solutions for MO CVD, as required by current semiconductor devices.
In addition, its dry etcher can be applied to both poly and metal processes. In order to overcome the weakness of serial antenna, it has applied ICP (inductive coupled plasma) method that employs a unique technology called 27/12MHz parallel resonance double-layered antenna.
Minimizing damage to wafers and producing W hard mask (SiN) selection ratio higher than others by 50% or more, this technology is drawing attention in the related markets as an alternative to the next-generation W-bit line & W-gate etcher.
• Jusung Engineering Co., Ltd.
49, Neungpyeong-ri, Opo-eup, Gwangju, Gyeonggi-do, Korea
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